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Thermal Management

Mittwoch/Wednesday, 03.04.2019, CSEM NE


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Thermal Management in Photonics Packaging

Joint workshop of Swissphotonics NTN (SPPL - Swiss Photonic Packaging Laboratory) with CSEM SA

Abstract
Photonic packaging aspects have to consider optical, electrical, thermal, and mechanical designs. Among them, heat dissipation and thermal stresses are key photonic packaging issues, which often have to be matched against stringent cost requirements.

For example, the high wavelength sensitivity to temperature of many optical components necessitates temperature control and in some cases active cooling. Further, thermal stresses arising from a mismatch in thermal expansion using dissimilar materials for packaging, affects performance and reliability.

This workshop is going to address these topics with presentations on selected solutions in various areas of applications.

Target public
R & D, companies (from SMEs to LMEs) and researchers generically interested to expand their view in the field of photonic packaging and seeking a networking environment to discuss solutions.
 
Program
10:30 Registration, Welcome Coffee
11:00 Dr.-Ing. Stefan Mohrdiek, Moderation, Welcome CSEM SA and SPPL
Dr. Christian Bosshard, Welcome Swissphotonics NTN
11:10 Lab/Showroomtour CSEM fully booked
11:45 Lunch, Sponsoring Swissphotonics NTN
13:00 Industry talks
14:20 Networking Break
15:00 SPPL talks
16:00 Discussion of topics, all presenters & moderator
16:30 Apéro riche, Sponsoring Swissphotonics NTN

Date
Wednesday, 3. April 2019

Venue
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CSEM SA Headquarters, Neuchâtel
Rue Jaquet-Droz 1
2002 Neuchâtel
Directions

Conference Language
English

Costs
This Workshop is free of charge
including Lunch, Break and Apéro

Registration compulsory
(Link on top of the page)
Deadline: 28. March 2019

The labtour, showroom visit is fully booked


Contact CSEM SA
Dr. Stefan Mohrdiek
Head Packaging & Optics at CSEM SA, 6055 Alpnach-Dorf OW
+41 41  672 75 28

Contact Swissphotonics
Dr. Christoph S. Harder
President Swissphotonics NTN
+41 79 219 90 51


19. März 2019, Beni Muller + Iris Bollinger
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Program
Dr.-Ing. Stefan Mohrdiek; Head of Packaging & Optics, CSEM SA, 6055 Alpnach-Dorf OW Moderation, Welcome CSEM SA and SPPL Icon (56 KB) 
Dr. Christian Bosshard; Vice-President Center Muttenz, CSEM SA 4132 Muttenz BL
Manager Swissphotonics NTN, 8832 Wollerau SZ
Welcome Swissphotonics NTN Icon (56 KB) 
Joël Grognuz; Head of Engineering, CADFEM (Suisse) AG, 1020 Renens VD Multiphysics numerical simulation for photonics packaging Icon (56 KB) 
Dr. Bruno Michel; Manager Smart System Integration, IBM Research Laboratory, 8803 Rüschlikon ZH Ultimately Dense and Efficient Future Computers Icon (56 KB) 
Dr. Antoine Müller; CEO Alpes Laser SA, 2072 Saint-Blaise NE Thermal management of Packaged QCL Icon (56 KB) 
Dr. Johanna Wolf; R&D engineer high power diode laser bars, II-VI Laser Enterprise GmbH, 8045 Zürich Actively Cooled Diode Laser Bars: Requirements and Assembly Technology Icon (56 KB) 
Prof. Dr.-Ing. habil. Jolanta Janczak-Rusch; Group Leader, Laboratory for Joining Technologies & Corrosion, Empa, 8600 Dübendorf ZH Nanojoining technologies for miniaturized assemblies Icon (56 KB) 
Dietmar Bertsch; Dipl.-Ing. HTL, Senior Engineer feasibility studies, Institut für Mikro- und Nanotechnologie MNT, NTB, 9471 Buchs SG Cooling methods for high thermal load devices Icon (56 KB) 
Guido Spinola Durante; Expert R&D Engineer CSEM SA, 6055 Alpnach Dorf OW Thermal Management Solutions for Optoelectronics Packages Icon (56 KB) 
Dr.-Ing. Stefan Mohrdiek; CSEM SA Discussion of topics, all presenters & moderator Icon (56 KB) 
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Verein Schweizer Laser und Photonik Netz  |  Sihleggstrasse 23  |  CH-8832 Wollerau  |  E-Mail