Host a Workshop from the Swiss National Laboratory for Photonic Packaging SPPL:

Miniaturized Photonic Packaging

Abstract
Miniaturization in photonic systems continues to be a primary driver of innovation. Increasing complexity demand hybrid integration of micro-optical, micro-electronic, and micro-mechanical components on smart system platforms. The assembly of such miniaturized components and sub-assemblies in complex 3D-shaped geometries requires new approaches in handling and packaging technologies to meet the requirements in terms of accuracy during assembly as well as long term stability under various environmental conditions.
This workshop is going to address these topics.

Target public
R & D, companies (from SMEs to LMEs) and researchers in the field of optical packaging, including light sources, optical connectors, sensors, environmental / medical instrumentation and bio implants with optical sub-modules.

Agenda
10:30 Registration, welcome coffee: CSEM SA, 2 Floor
11:00 Lab Tour CSEM SA booked up: CSEM SA, 2 Floor
11:45 Networking Lunch: Terrace Credimex AG, 4 Floor
13:15 Talks at Credimex AG, 3 Floor
17:00 Apéro Riche: Terrace Credimex AG, 4 Floor

Conference language
English

Cost
This workshop is free of charge.

Registration
Deadline: 8. May 2017
Registration compulsory
(Link on top of the page.)

Venue                                                          

CSEM SA
Untere Gründlistrasse 1
6055 Alpnach-Dorf OW
No parking spaces
8 min walking distance from train station Alpnach Dorf
Map
Directions

Program Chair
Dr.-Ing. Stefan Mohrdiek
Head Packaging & Optics at CSEM SA
041 672 75 11

Contact
Christoph S. Harder
President Swissphotonics
079 219 90 51

In collaboration with:






15.08.2017 Jennifer Pelikan + Beni Muller