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Miniaturized Photonic Packaging

Dienstag/Tuesday, 16.05.2017, CSEM, Alpnach

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Host a Workshop from the Swiss National Laboratory for Photonic Packaging SPPL:

Miniaturized Photonic Packaging

Abstract
Miniaturization in photonic systems continues to be a primary driver of innovation. Increasing complexity demand hybrid integration of micro-optical, micro-electronic, and micro-mechanical components on smart system platforms. The assembly of such miniaturized components and sub-assemblies in complex 3D-shaped geometries requires new approaches in handling and packaging technologies to meet the requirements in terms of accuracy during assembly as well as long term stability under various environmental conditions.
This workshop is going to address these topics.

Target public
R & D, companies (from SMEs to LMEs) and researchers in the field of optical packaging, including light sources, optical connectors, sensors, environmental / medical instrumentation and bio implants with optical sub-modules.

Agenda
10:30 Registration, welcome coffee
11:00 Lab Tour CSEM SA
11:45 Networking Lunch
13:15 Talks at Credimex AG
17:00 Apéro Riche

Conference language
English

Cost
This workshop is free of charge.

Registration
Deadline: 8. May 2017
Registration compulsory
(Link on top of the page.)

Venue                                                          
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CSEM SA
Untere Gründlistrasse 1
6055 Alpnach-Dorf OW


Program Chair
Dr.-Ing. Stefan Mohrdiek
Head Packaging & Optics at CSEM SA
041 672 75 11

Contact
Christoph S. Harder
President Swissphotonics
079 219 90 51

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10.04.2017 Beni Muller + Jennifer Pelikan
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Program
Dr. Alexander Steinecker; Business Development Manager Microassembly & Robotics, CSEM SA, 6055 Alpnach-Dorf OW Labtour Icon (48 KB) 
Dr. Stefan Mohrdiek; Coordinator SPPL, Head Packaging and Optics, CSEM SA, 6055 Alpnach-Dorf OW Moderation
Welcome from CSEM SA and SPPL
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Dr. Christian Bosshard; Manager Swissphotonics, Vice-President Center Muttenz, CSEM SA, 4132 Muttenz BL Welcome from Swissphotonics Icon (48 KB) 
Roger Schelbert; Business Unit Manager Robotic & Vision Technology, Credimex AG, 6055 Alpnach-Dorf OW Welcome from Credimex AG Icon (48 KB) 
Dr. Bastian Rheingans; Laboratory for Joining Technologies & Corrosion, Empa, 8600 Dübendorf ZH Development of reactive joining technologies for electronic packaging and assembly Icon (48 KB) 
Dr. Mark Fretz; ,Senior R&D research engineer and project manager, Packaging & Optics, CSEM SA, 6055 Alpnach-Dorf OW Miniaturized hermetic packages in glass and sapphire Icon (48 KB) 
Johannes Kremmel; R&D Photonics, Institute of Micro- and Nanotechnology MNT, Interstate University of applied Sciences Buchs NTB, 9471 Buchs SG Passively aligned fiber-coupling of planar integrated waveguides Icon (48 KB) 
Dr. Bert Jan Offrein; Manager Neuromorphic Devices and Systems, IBM Research GmbH, 8803 Rüschlikon ZH Scalable electro-optical packaging of silicon photonics components Icon (48 KB) 
Michael Huber; Research & Development, Head of Advanced Optical Components, Fisba AG, 9016 St. Gallen Collimation Optics for Laser Diodes: Novelties and Assemblies Icon (48 KB) 
Dr. Pietro Bernasconi; Technical Sales Manager, Diamond SA, 6616 Losone TI Fiber Bragg gratings integrated into fiber optic connector (OLiD) Icon (48 KB) 
Dr. Christoph S. Harder; President Swissphotonics, 8832 Wollerau SZ Chair
Gap Closure Discussion
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