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Electro-optical 3D hetero-integration

Donnerstag/Thursday, 24.10.2019, Dübendorf

IEEE EPS Lecture

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Electro-optical 3D Hetero-integration of multifunctional systems

As part of continuing education program, EPS Switzerland chapter in collaboration with Swiss Photonics Packaging Lab SPPL, is organizing a lecture about Electro-optical 3D Hetero-integration of multifunctional systems by Prof. Dr. Karlheinz Bock. The goal of this program is to provide a platform where people can get an in-depth knowledge about the current trends in electronic packaging field, and to enable information exchange about their activities and interests.

Date
Thursday, October 24, 2019
 
Program
 
14:30  EPS Welcome and Introduction
Rony Jose James, IEEE EPS Switzerland chapter chairman, CSEM SA
14:40 Introduction to SPPL
Stefan Mohrdiek, CSEM SA
14:50 Introduction to Empa
Pierangelo Gröning, Member of the Board of Directors / Department Head, Empa
15:00 Electro-optical 3D Hetero-integration of multifunctional systems
Prof. Dr.-Ing. Dr. h.c. Karlheinz Bock, Chair of electronics packaging and director of the institute for electronics packaging IAVT at TU Dresden
16:30 Lab tour of Empa
Lars Jeurgens, Laboratory Head Joining Technologies & Corrosion, Empa
17:30 Apéro
 

Arrival
Empa
Materials Science and Technology
Überlandstrasse 129
8600 Dübendorf ZH
Directions

Location
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Eawag Forum Chriesbach
(next to Empa)
Überlandstrasse 133
8600 Dübendorf ZH

Flyer (164 KB)

Registration
Rony Jose James

Deadline for Registration
October 14, 2019


Contact
Rony Jose James
Chapter Chair  
IEEE EPS Switzerland

Contact Swissphotonics NTN
Dr.-Ing. Stefan Mohrdiek
Head SPPL


14. October 2019, Beni Muller + Iris Bollinger
Swissphotonics, Verein Schweizer Laser und Photonik Netz VSLP | Sihleggstrasse 23 | CH-8832 Wollerau | E-Mail | |