Hybrid Integration
Photonic Integration and Packaging
As demand for photonic systems continues to grow across a wide range of current and emerging markets—including optical communications, sensing, quantum computing, autonomous driving, artificial intelligence, augmented and virtual reality, and medical applications—the complexity of photonic packaging is also increasing. Swiss industry, particularly start-ups and SMEs, commonly face challenges in assembly and packaging, testing, and qualification.
In Switzerland we have two institutions to support Swiss industry in their photonics integration and packaging tasks, Swiss PIC and the Sensor Innovation Hub and Photonics at OST:
Swiss PIC, the Swiss Photonics Integration Center
The start-up Swiss PIC AG provides precision assembly and packaging solutions for photonics systems. The complete packaging offering - including optical, electrical, thermal and mechanical technology - ensures a controlled interfacing of photonic systems with the environment. Building up on a long history of precision engineering in Switzerland, the photonics packaging center offers highest standards in terms of quality and precision. It provides customers with packaging services covering prototyping as well as series production. The center located in the Switzerland Innovation Park Innovaare next to PSI and invested in qualified industrialized processes, high-tech machinery, and will operate a 200 m2 packaging fab with a qualified piloting and production line.
Swiss PIC is a member of the Advanced Manufacturing Technology Transfer Centers (AM-TTC) Alliance. The center is funded by the ETH Board as well as by federal funds according to Art. 15 FIFG.
Contact Swiss PIC
Dr. Christoph Harder
Interim CEO
+41 79 219 90 51
www.swiss-pic.ch
Sensor Innovation Hub and Photonics
The Sensor Innovation Hub is Eastern Switzerland‘s competence center for miniaturized sensors and compact photonic solutions. Serving as a link between industry and research along the sensor value chain. They offer access to cutting-edge microtech infrastructure and specialized staff training.
They partner with OST – Fachhochschule of Eastern Switzerland and its Institute for Microtechnology and Photonics (IMP) for advanced research in photonics. Their expertise spans optical metrology, fiber optics, and laser processing, focusing on high-precision glass microfabrication and system integration. Young talents are trained in the MSE master’s program “Photonic and Laser Engineering”.
Contact Sensor Hub
Prof. Dr. Tobias Lamprecht
Head Institute for Microtechnology and Photonics (IMP)
+41 58 257 34 22
www.innovationspark-ost.ch/en/innovation-hubs/sensors/
Contact Swissphotonics
Dr. Christian Bosshard
Managing Director Swissphotoncis
+41 79 405 1826
28 October 2025, Christian Bosshard
As demand for photonic systems continues to grow across a wide range of current and emerging markets—including optical communications, sensing, quantum computing, autonomous driving, artificial intelligence, augmented and virtual reality, and medical applications—the complexity of photonic packaging is also increasing. Swiss industry, particularly start-ups and SMEs, commonly face challenges in assembly and packaging, testing, and qualification.
In Switzerland we have two institutions to support Swiss industry in their photonics integration and packaging tasks, Swiss PIC and the Sensor Innovation Hub and Photonics at OST:
Swiss PIC, the Swiss Photonics Integration Center
The start-up Swiss PIC AG provides precision assembly and packaging solutions for photonics systems. The complete packaging offering - including optical, electrical, thermal and mechanical technology - ensures a controlled interfacing of photonic systems with the environment. Building up on a long history of precision engineering in Switzerland, the photonics packaging center offers highest standards in terms of quality and precision. It provides customers with packaging services covering prototyping as well as series production. The center located in the Switzerland Innovation Park Innovaare next to PSI and invested in qualified industrialized processes, high-tech machinery, and will operate a 200 m2 packaging fab with a qualified piloting and production line.
Swiss PIC is a member of the Advanced Manufacturing Technology Transfer Centers (AM-TTC) Alliance. The center is funded by the ETH Board as well as by federal funds according to Art. 15 FIFG.
Contact Swiss PIC
Dr. Christoph Harder
Interim CEO
+41 79 219 90 51
www.swiss-pic.ch
Sensor Innovation Hub and Photonics
The Sensor Innovation Hub is Eastern Switzerland‘s competence center for miniaturized sensors and compact photonic solutions. Serving as a link between industry and research along the sensor value chain. They offer access to cutting-edge microtech infrastructure and specialized staff training.
They partner with OST – Fachhochschule of Eastern Switzerland and its Institute for Microtechnology and Photonics (IMP) for advanced research in photonics. Their expertise spans optical metrology, fiber optics, and laser processing, focusing on high-precision glass microfabrication and system integration. Young talents are trained in the MSE master’s program “Photonic and Laser Engineering”.
Contact Sensor Hub
Prof. Dr. Tobias Lamprecht
Head Institute for Microtechnology and Photonics (IMP)
+41 58 257 34 22
www.innovationspark-ost.ch/en/innovation-hubs/sensors/
Contact Swissphotonics
Dr. Christian Bosshard
Managing Director Swissphotoncis
+41 79 405 1826
28 October 2025, Christian Bosshard
