Photonics Integration and Packaging

Thu, 21.03.2024, CSEM Neuchatel

Photonics Integration and Packaging

Swiss PIC, the Swiss Photonics Integration Center organizes a workshop on Photonics Integration and Packaging supported by Swissphotonics and CSEM.

With the ever-increasing demand of photonic systems in existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others, the complexity of photonic packaging is also increasing. Common challenges for Swiss industry, especially start-ups and SMEs include assembly & packaging, testing and qualification. The workshop addresses these challenges and is a unique opportunity to discuss with colleagues and develop new solutions.
 

Labtour
CSEM is offering optional labtours:
  • Micro-optics / micro-optical interconnects cleanroom tour
    • Starting at 11:30, max number of participants: 6.
  • PIC testing and characterization
    • Starting at 11:15, max number of participants: 8
In case of interest please send an E-Mail to andreas.voelker@csem.ch !


Cost
This workshop is free of charge

Registration compulsory
This Workshop is free of charge, but registration is required. The link is on top of the page. If you would like to register more than one participant, please fill for each an individual form.
Deadline for registration:  12 March 2024


Program
11:00 Registration and coffee
11:00-13:00 Labtour
12:00-13:00 Lunch
13:15 Welcome
13:30 Industrial packaging (requirements)
14:30 Networking break
15:00 Components and processes
16:00 Networking Break
16:30 Packaging services
17:30 Apéro
19:00 End


Detailed Program

Date
Thursday, 21 March 2024

Venue


CSEM SA
Rue Jaquet-Droz 1
2002 Neuchâtel
Switzerland





Contact Swiss PIC
Dr. Peter Moselund
CEO Swiss PIC
+41 76 765 5519

Contact CSEM
Dr. Andreas Völker
Head Business Development Photonics CSEM
+41 76 442 2429

Contact Swissphotonics
Dr. Christian Bosshard
Managing Director Swissphotonics
+41 79 405 1826



29 January 2024, Christian Bosshard
Technologies and Markets - III
▶ Registration
Program
Peter Moselund, CEO Swiss PIC
Link
Welcome
Christian Bosshard, Managing Director Swissphotonics
Link
Welcome
Guillaume Basset, Micro-Nano-Optics group leader CSEM
Link
Welcome
Christoph Harder, President Swissphotonics
Link
Moderation Industrial packaging (requirements)
Maxim Karpov, Co-founder Enlightra
Link
Challenges of PIC packaging for nonlinear photonics
Marcus Duelk, CTO EXALOS
Link
Micro-optical free-space assembly for semiconductor light sources from the visible to the near-infrared wavelength range
Nikolaus Flöry, BD Manager Vario-optics
Link
Board-Level Photonics: Embedded Waveguides solving Photonic Chip Assembly Bottlenecks
Peter Moselund, CEO Swiss PIC
Link
Moderation Components and processes
Myun-Sik Kim, Principal Strategic Business Development Axetris
Link
An Industrial Perspective: How Microlenses Define the Path of Photonics Integration
Rolando Ferrini, Chief Regional Officer; Head of FEMTOprint Neuchâtel
Link
From high-precision glass micro-components to monolithically integrated glass micro-systems for fiber-to-chip connectivity
Ivan Shorubalko, EMPA
Link
Towards a digital Lippmann camera: integration challenges
Andreas Voelker, Head of Research & BD Photonics CSEM
Link
Moderation Packaging services
Tobias Lamprecht, Innovation Microtechnology and Photonics OST
Link
Microtechnology approaches for customized photonic packages
Mark Fretz, R&D engineer CSEM
Link
Photonic chip integration strategies for micro-fluidic cartridges
Peter Moselund, CEO Swiss PIC
Link
PIC Packaging and Swiss PIC
Swissphotonics, Verein Schweizer Laser und Photonik Netz VSLP | Sihleggstrasse 23 | CH-8832 Wollerau | E-Mail | |