Workshop: Photonics Packaging for Harsh Environments

Mon, 08.06.2015, CSEM SA Alpnach

Swissphotonics and the Swiss National Laboratory for Photonic Packaging SPPL invite to a workshop on packaging for harsh environments with CSEM SA, Empa and NTB-MNT.

Abstract
There are many applications where photonic packages face harsh environments that are beyond the range of standard use conditions. Commercial-off-the-shelf photonic components and modules are usually designed for moderate temperatures (0°C to 70°C) and to operate in stable, clean, indoor controlled environments. Harsh environments require higher grade packaging with screening and testing of these devices to more severe limits like high temperatures along with other adverse conditions such as high levels of EMI or radiation, extreme temperature cycling, shock, vibration, as well as being exposed to a variety of contaminants.

Target public
R & D, companies (from SMEs to LMEs) and researchers in the field of optical packaging, including light sources, optical connectors, sensors, environmental / medical instrumentation and bio implants with optical sub-modules.

Agenda
11:00 Registration, welcome coffee (Sponsoring Swissphotonics)
11:30 Lab Tour CSEM SA. Meeting: ZIGG building
12:00 Lunch
13:30 Talks
14:40 Networking Break 35' (Sponsoring Swissphotonics)
15:15 Talks
16:15 Workshops in groups
17:00 Apéro riche (till 18:30)
18:30 End of workshop

Conference language
English

Cost
This workshop is free of charge

Venue
ZIGG building
Industriestrasse 23
6055 Alpnach Dorf OW
Map

Deadline for inscription
01.06.2015

Program Chair
Dr. Stefan Mohrdiek
Head Packaging & Optics at CSEM

Contact
Dr. Christoph S. Harder
President Swissphotonics
+41 79 219 90 51


Beni Muller, 6. Mai 2015

Speakers (PDF)
Program
Dr. Helmut F. Knapp; Head Tools & Instruments for Life Sciences, CSEM SA Alpnach OW
Link
Labtour
Dr. Stefan Mohrdiek; Coordinator SPPL, Head Packaging and Optics, CSEM SA Alpnach OW
Link
Welcome Mohrdiek
Dr. Laurent Aebi; Vice Director, MC-Monitoring SA, Givisiez FR
Link
Integrated fiber optics acceleration sensors for hazardous environments Aebi
Dr. Max Stumpf; Development Engineer Laser and Photonics, RUAG Space, Zürich
Link
Photonics Packaging for Space Environment Stumpf
Ulrich Stärker; CTO Volpi AG Schlieren ZH
Link
Life Science Tools and In-Vitro Diagnostics – Challenges for industrialization of OEM-solutions Stärker
MSc. Rony-Jose James; Senior R&D Engineer, CSEM
Link
Optical and RF transparent long-term biocompatible packages Jose-James
Dipl.-Ing. HTL Dietmar Bertsch; NTB-MNT, Buchs SG
Link
Industry-Driven Packaging Solution: Delicate Devices in Harsh Environments Bertsch
Dr. Lars P. H. Jeurgens; Head of the laboratory Joining Technologies & Corrosion, Empa, Dübendorf ZH
Link
Recent developments of joining technologies for ever more complex industrial requirements Jeurgens
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