Inauguration of Swiss PIC Packaging Fab / Workshop on Photonic Integration and Packaging

Mon, 24.11.2025, Park Innovaare, Villigen


 

Swiss PIC, the Swiss Photonics Integration Center and Swissphotonics organize a workshop on Photonics Integration and Packaging

Vision: Address the challenges for Swiss industry in photonics integration and packaging, especially start-ups and SMEs, and support the photonics industry in this area to realize its enormous growth potential.

Rationale: As demand for photonic systems continues to grow across a wide range of current and emerging markets—including optical communications, sensing, quantum computing, autonomous driving, artificial intelligence, augmented and virtual reality, and medical applications—the complexity of photonic packaging is also increasing. Swiss industry, particularly start-ups and SMEs, commonly face challenges in assembly and packaging, testing, and qualification. This workshop aims to address these issues and provides a valuable forum for discussion among professionals, fostering the development of innovative solutions
 
Labtour
As a central hub for the integration of photonic components and systems, Swiss PIC offers the local and European photonics community high-quality consulting and specialized services through to series production. A tour of Swiss PIC's new Packaging Fab is part of the workshop

Cost
This workshop is free of charge

Registration compulsory
This Workshop is free of charge, but registration is required. The link is on top of the page. If you would like to register more than one participant, please fill for each an individual form.
Deadline for registration 17 November 2025


Program overview

Detailed program

Date
Monday, 24 November 2025, 10:30 - 19:00

Venue

Park Innovaare
Parkstrasse 1
5234 Villigen





Contact Swiss PIC
Dr. Christoph Harder
Interim CEO
+41 79 219 90 51

Contact Swissphotonics
Dr. Christian Bosshard
Managing Director Swissphotonics
+41 79 405 1826


12 August 2025, Christian Bosshard
▶ Registration
Program
Christian Bosshard, Swissphotonics
Link
Welcome, Introduction, Moderation Session 1
Christoph Harder, Swiss PIC
Link
The Swiss Photonics Integration Center
Stefan Abel, Lumiphase
Link
Swiss high-speed PICs for data centers
Jürg Leuthold, ETH Zurich
Link
Packaging for ultra high-speed devices
Jérémy Borsenberger, Yotavis
Link
Packaging the Future: Unlocking Photonics in Switzerland
Peter Moselund, Swiss PIC
Link
Labtour
Dieter Eglin, Kanton Aargau
Link
Welcome
Florian Geiger
Link
Park Innovaare
Andreas Völker, CSEM
Link
Panel Moderation: Packaging hub vs in-house packaging: How many packaging robots do we need?
John Jost, Enlightra
Link
Panel: Packaging hub vs in-house packaging: How many packaging robots do we need?
Tobias Lamprecht, Sensor Innovation Hub
Link
Panel: Packaging hub vs in-house packaging: How many packaging robots do we need?
Andreas Hugi, Sensirion / Swiss PIC
Link
Panel: Packaging hub vs in-house packaging: How many packaging robots do we need?
Karlheinz Gulden
Link
Panel: Packaging hub vs in-house packaging: How many packaging robots do we need?
Kirsten Moselund, PSI & EPFL
Link
Moderation Session 2
Pavel Hrmo, ZuriQ
Link
Integrated photonics for scaling trapped ion quantum computing
Cornelius Hempel, PSI
Link
The packaging challenge in laser-based trapped-ion quantum computing
Thorsten Mayer, Vanguard Automation
Link
3D nano-printing is lighting the path toward scalable and reliable processes for seamlessly integrating active components into PICs
Christoph Harder, Swiss PIC
Link
Moderation Session 3
Florian Emaury, Menhir Photonics
Link
Towards mass production of laser modules
Marcus Duelk, Exalos / indie
Link
Micro-optical integration of SLED and LD light sources from the near-UV to the NIR
Markus Rossi, AlphaLum
Link
Shaping Light for XR devices: Photonic and Optics Integration Challenges and Opportunities
Swissphotonics, Verein Schweizer Laser und Photonik Netz VSLP | Sihleggstrasse 23 | CH-8832 Wollerau | E-Mail | |