▶ Registration |
Program | ||
Christian Bosshard, Swissphotonics Link | Welcome, Introduction, Moderation Session 1 | |
Christoph Harder, Swiss PIC Link | The Swiss Photonics Integration Center | |
Stefan Abel, Lumiphase Link | Swiss high-speed PICs for data centers | |
Jürg Leuthold, ETH Zurich Link | Packaging for ultra high-speed devices | |
Jérémy Borsenberger, Yotavis Link | Packaging the Future: Unlocking Photonics in Switzerland | |
Peter Moselund, Swiss PIC Link | Labtour | |
Dieter Eglin, Kanton Aargau Link | Welcome | |
Florian Geiger Link | Park Innovaare | |
Andreas Völker, CSEM Link | Panel Moderation: Packaging hub vs in-house packaging: How many packaging robots do we need? | |
John Jost, Enlightra Link | Panel: Packaging hub vs in-house packaging: How many packaging robots do we need? | |
Tobias Lamprecht, Sensor Innovation Hub Link | Panel: Packaging hub vs in-house packaging: How many packaging robots do we need? | |
Andreas Hugi, Sensirion / Swiss PIC Link | Panel: Packaging hub vs in-house packaging: How many packaging robots do we need? | |
Karlheinz Gulden Link | Panel: Packaging hub vs in-house packaging: How many packaging robots do we need? | |
Kirsten Moselund, PSI & EPFL Link | Moderation Session 2 | |
Pavel Hrmo, ZuriQ Link | Integrated photonics for scaling trapped ion quantum computing | |
Cornelius Hempel, PSI Link | The packaging challenge in laser-based trapped-ion quantum computing | |
Thorsten Mayer, Vanguard Automation Link | 3D nano-printing is lighting the path toward scalable and reliable processes for seamlessly integrating active components into PICs | |
Christoph Harder, Swiss PIC Link | Moderation Session 3 | |
Florian Emaury, Menhir Photonics Link | Towards mass production of laser modules | |
Marcus Duelk, Exalos / indie Link | Micro-optical integration of SLED and LD light sources from the near-UV to the NIR | |
Markus Rossi, AlphaLum Link | Shaping Light for XR devices: Photonic and Optics Integration Challenges and Opportunities |