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Workshop: Photonics Packaging for Harsh Environments

Montag/Monday, 08.06.2015, CSEM SA Alpnach

Swissphotonics and the Swiss National Laboratory for Photonic Packaging SPPL invite to a workshop on packaging for harsh environments with CSEM SA, Empa and NTB-MNT.

Abstract
There are many applications where photonic packages face harsh environments that are beyond the range of standard use conditions. Commercial-off-the-shelf photonic components and modules are usually designed for moderate temperatures (0°C to 70°C) and to operate in stable, clean, indoor controlled environments. Harsh environments require higher grade packaging with screening and testing of these devices to more severe limits like high temperatures along with other adverse conditions such as high levels of EMI or radiation, extreme temperature cycling, shock, vibration, as well as being exposed to a variety of contaminants.

Target public
R & D, companies (from SMEs to LMEs) and researchers in the field of optical packaging, including light sources, optical connectors, sensors, environmental / medical instrumentation and bio implants with optical sub-modules.

Agenda
11:00 Registration, welcome coffee (Sponsoring Swissphotonics)
11:30 Lab Tour CSEM SA. Meeting: ZIGG building
12:00 Lunch
13:30 Talks
14:40 Networking Break 35' (Sponsoring Swissphotonics)
15:15 Talks
16:15 Workshops in groups
17:00 Apéro riche (till 18:30)
18:30 End of workshop

Conference language
English

Cost
This workshop is free of charge

Venue
ZIGG building
Industriestrasse 23
6055 Alpnach Dorf OW
Map

Deadline for inscription
01.06.2015

Program Chair
Dr. Stefan Mohrdiek
Head Packaging & Optics at CSEM

Contact
Dr. Christoph S. Harder
President Swissphotonics
+41 79 219 90 51


Beni Muller, 6. Mai 2015

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Icon Participants (PDF) (106 KB) 
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Program
Dr. Helmut F. Knapp; Head Tools & Instruments for Life Sciences, CSEM SA Alpnach OW Labtour Icon (52 KB) 
Dr. Stefan Mohrdiek; Coordinator SPPL, Head Packaging and Optics, CSEM SA Alpnach OW Welcome Icon Mohrdiek (1.13 MB) 
Dr. Laurent Aebi; Vice Director, MC-Monitoring SA, Givisiez FR Integrated fiber optics acceleration sensors for hazardous environments Icon Aebi (1.2 MB) 
Dr. Max Stumpf; Development Engineer Laser and Photonics, RUAG Space, Zürich Photonics Packaging for Space Environment Icon Stumpf (3.44 MB) 
Ulrich Stärker; CTO Volpi AG Schlieren ZH Life Science Tools and In-Vitro Diagnostics – Challenges for industrialization of OEM-solutions Icon Stärker (751 KB) 
MSc. Rony-Jose James; Senior R&D Engineer, CSEM Optical and RF transparent long-term biocompatible packages Icon Jose-James (1.83 MB) 
Dipl.-Ing. HTL Dietmar Bertsch; NTB-MNT, Buchs SG Industry-Driven Packaging Solution: Delicate Devices in Harsh Environments Icon Bertsch (2.68 MB) 
Dr. Lars P. H. Jeurgens; Head of the laboratory Joining Technologies & Corrosion, Empa, Dübendorf ZH Recent developments of joining technologies for ever more complex industrial requirements Icon Jeurgens (2.59 MB) 
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