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Laser machining of ultra-hard materials

Donnerstag/Thursday, 13.11.2014, Zurich

Inspire Laser Kolloquium
Fertigungstechnisches Seminar


Das Institut für Werkzeugmaschinen und Fertigungstechnik (IWF) der ETH Zürich veranstaltet in Zusammenarbeit mit der inspire AG ein Laser-Seminar.

Laser machining of ultra-hard materials DIPLAT is collaborative research project funded by the European Commission to investigate and demonstrate the ability for an integrated Pulsed Laser Ablation (PLA) technology to produce diamond and cBN tools with enhanced functionality for high performance and ultra precision machining operations. The open meeting will explore the following topics: • Industrial potential for short and ultra-short pulsed laser machining of ultra-hard materials • CAM/Simulation developments of the ultra-short laser pulse machining • Latest advances in multi-axis laser production centers • Novel laser manufacturing strategies for grinding, polishing and micro-tools

Programm /Agenda
13:00 - 18:00 Programm
Laser machining of ultra-hard materials
Fertigungstechnisches Kolloquium
Gesamtprogramm

Adresse / Venue
ETH Hauptgebäude (HG) / ETH main building (HG)
Hörsaal HG E3
Rämistrasse 101
8006 Zürich
Campus map

Konferenzsprache / Conference language
Deutsch / English

Kosten /Cost
Der Eintritt ist frei / Admission is free

Kontakt / Contact
inspire AG


Beni Muller, 3. November 2014
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Program
Prof. Dr. Konrad Wegener, IWF ETH Zurich Welcom Icon (34 KB) 
Chris Wort, Technical Manager Element Six Ltd, De Beer Group of companies Recent developments on ultrahard material systems for tooling application Icon (34 KB) 
Dr. Claus Dold, EWAG AG, United Grinding Group Advanced Control and Machinery for Tool Processing with Ultrafast Lasers Icon (34 KB) 
Dr. Paul Butler-Smith, Laser pulse ablation strategies for advanced abrasive surfaces and micro tools Icon (34 KB) 
Maximilian Warhanek IWF ETH Z├╝rich Tangential ultrashort pulsed laser processing for diamond tool finishing applications Icon (34 KB) 
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