Agenda
31.05.2013: EPFL
VCSEL-days
05.06.2013: CSEM Alpnach
Packaging & Laser Services
12.06.2013: Genève EPMT
Swiss Laser Microprocessing Solutions
13.06.2013: Genève EPMT
Conferences Procedes Laser Industriels
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Plastic Electronics
7th Plastic Electronics 2011 Conference & Exhibition
11-13 October 2011 Dresden, Germany
Co-location of two major events:
Plastic Electronics Conference & Exhibition 2011
Semicon Europa Conference & Exhibition 2011
At this year’s event the following core application areas of flexible organic & large area electronics will be at the focus of attention: OLEDs for Displays & Lighting, Flexible Photovoltaics, Organic Sensors & Actuators as well as Integrated Smart Systems. Come and share your vision with over 100 top experts from science & technology in the field.
Co-integration. Over the last twelve months we have seen excellent progress in R&D in all application areas. Market introductions are underway. In order to speed up commercialization still a lot of work needs to be done to improve the efficiencies and lifetime of the materials. In cost-down processing and manufacturing. And to combine flexible organic and large area electronics with traditional silicon based microelectronics. This is what we call co-integration. Aiming to combine the best of two worlds! Come and join us in Dresden to see how it can and will be done!
Prof. Dr. Karl Leo, Conference Chair
Ed van den Kieboom, Conference Director
11-13 October 2011 Dresden, Germany
Co-location of two major events:
Plastic Electronics Conference & Exhibition 2011
Semicon Europa Conference & Exhibition 2011
At this year’s event the following core application areas of flexible organic & large area electronics will be at the focus of attention: OLEDs for Displays & Lighting, Flexible Photovoltaics, Organic Sensors & Actuators as well as Integrated Smart Systems. Come and share your vision with over 100 top experts from science & technology in the field.
Co-integration. Over the last twelve months we have seen excellent progress in R&D in all application areas. Market introductions are underway. In order to speed up commercialization still a lot of work needs to be done to improve the efficiencies and lifetime of the materials. In cost-down processing and manufacturing. And to combine flexible organic and large area electronics with traditional silicon based microelectronics. This is what we call co-integration. Aiming to combine the best of two worlds! Come and join us in Dresden to see how it can and will be done!
Prof. Dr. Karl Leo, Conference Chair
Ed van den Kieboom, Conference Director
» previous news



